Simulator Coupling for Electro-Thermal Simulation of Integrated Circuits

The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a FEM program with a circuit simulator. In difference to other known simulator couplings the time step algorithm is used. Its implementation into simulation tools is described. The thermal modelling of the die/package structure and the extended modelling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results.